Title:
SOLVENT-BASED ADHESIVE
Document Type and Number:
Japanese Patent JP3333575
Kind Code:
B2
Abstract:
PURPOSE: To obtain a solvent-based adhesive having excellent initial tack and application workability and having a long pot life by adding a plasticizer and a specified surfactant to an adhesive comprising a low-boiling solvent and a binder.
CONSTITUTION: A plasticizer (e.g. dimethyl phthalate) and a surfactant being difficultly soluble in the low-boiling solvent and desirably having an HLB of 1-7 (e.g. polyoxyethylene lauryl ether) are added to an adhesive comprising a low-boiling solvent (e.g. methanol) and a binder (e.g. vinyl acetate/acrylic copolymer).
Inventors:
Yasumasa Takao
Mayumi Odashima
Mayumi Odashima
Application Number:
JP6617693A
Publication Date:
October 15, 2002
Filing Date:
March 01, 1993
Export Citation:
Assignee:
Toli Co., Ltd.
International Classes:
C08K5/06; C08L31/04; C09J11/06; C09J131/04; (IPC1-7): C09J11/06; C09J131/04
Domestic Patent References:
| JP4932936A | ||||
| JP62164781A | ||||
| JP61197663A | ||||
| JP59202247A | ||||
| JP55104342A | ||||
| JP5529575A | ||||
| JP5367739A | ||||
| JP5240540A | ||||
| JP4145182A | ||||
| JP5105855A |
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