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Title:
SOLVENTLESS THERMOSETTING COMPOSITION WHICH IS LIQUID AT ORDINARY TEMPERATURE AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2022104654
Kind Code:
A
Abstract:
To provide a solventless thermosetting composition which is liquid at ordinary temperature and gives a cured product having excellent heat resistance.SOLUTION: A bisphenol-A type cyanate resin which is solid at ordinary temperature is heat-melted to obtain a molten liquid. To this molten liquid is added and mixed trimethylolpropane diallyl ether which is liquid at ordinary temperature to obtain a liquid mixture. To this liquid mixture is added and mixed P-d type benzoxazine which is solid at ordinary temperature and the P-d type benzoxazine is melted, Thereafter, the mixture is cooled to room temperature to obtain a solventless thermosetting composition which is liquid at ordinary temperature and in which a reaction product of a polyfunctional cyanate compound and a hydroxyl group-containing compound, a polyfunctional cyanate compound, and a benzoxazine ring-containing compound are compatibilized. By using, as the molten liquid, a material obtained by heat-melting a bisphenol-A type cyanate resin which is solid at ordinary temperature and a polyfunctional maleimide compound which is solid at ordinary temperature, there is obtained a solventless thermosetting composition which is liquid at ordinary temperature and in which further a polyfunctional maleimide compound is compatibilized.SELECTED DRAWING: None

Inventors:
SATO SHINICHI
FUJINO NAOHIKO
YOSHIDA YOSHIAKI
ENDO TAKESHI
Application Number:
JP2020219733A
Publication Date:
July 11, 2022
Filing Date:
December 29, 2020
Export Citation:
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Assignee:
KONISHI CO LTD
International Classes:
C08G73/00; C08G14/073
Attorney, Agent or Firm:
Okumura Shigeki