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Title:
SOUND GENERATION PREVENTIVE STRUCTURE OF ENVELOPE
Document Type and Number:
Japanese Patent JPH09184255
Kind Code:
A
Abstract:

To construct an envelope such as wall, roof, or the like consisting of architectural board in the form of a folded board, with which it is possible to preclude sound generation caused by thermal expansion and contraction originating from a temp. difference in the coupling part to couple together adjoining boards.

A single-layer or multi-layer envelope is composed of an architectural board A1, a cap A2, and a non-metal soft material 5, wherein the board A1 is equipped with bent parts 3, 3 for fitting on both sides across the width of the uppermost layer. A plurality of such boards A1, A1... are laid in line. The non-metal soft material 5 is interposed between the mating fit bends 3, 3 of adjoining plates and the cap A2, and the cap is fitted on the bends 3, 3.


Inventors:
INOUE KAZUTAKE
KOUCHI YOSHIO
Application Number:
JP35452195A
Publication Date:
July 15, 1997
Filing Date:
December 30, 1995
Export Citation:
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Assignee:
SANKO METAL IND
International Classes:
E04D3/35; E04D3/36; E04D3/366; E04F13/12; (IPC1-7): E04D3/366; E04D3/35; E04D3/36; E04F13/12
Attorney, Agent or Firm:
Kunio Iwahori



 
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