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Title:
SOUND INSULATING FLOOR STRUCTURE
Document Type and Number:
Japanese Patent JP2011184935
Kind Code:
A
Abstract:

To provide a sound insulating floor structure by which sinkage of a floor material caused by walking is suppressed, good walk feeling is obtained, and excellent performance of insulating an impact sound of the floor is achieved.

The sound insulating floor structure is formed by laminating a shock-absorbing layer 2, a space layer 3, a wooden layer 4 and a floor finishing layer 5 in this order on a floor underlayer material 1. In the structure, supporting materials 6 are interposed between the shock absorbing layer 2 and the wooden layer 4. The shock absorbing layer can be a non-woven fiber structure having a thickness of 3-20 mm, and an apparent density of 0.03-0.2 g/cm3. (In particular, the non-woven fiber structure includes a wet-heat adhesive fiber which is fusion bonded to fix the fiber, and has a fiber bonding rate of 3-85%). The supporting materials can occupy an area of 10-70% of the floor area.


Inventors:
KINDEI HIDENORI
HIRATA KAZUTOSHI
HAYASHI KOHEI
KIYOOKA SUMIHITO
ADACHI ATSUMI
KOIKE TAKERU
Application Number:
JP2010050842A
Publication Date:
September 22, 2011
Filing Date:
March 08, 2010
Export Citation:
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Assignee:
NANAO KOGYO KK
KURARAY KURAFLEX CO LTD
International Classes:
E04F15/20; E04F15/18
Domestic Patent References:
JPS61163842U1986-10-11
JP2003056171A2003-02-26
JP2009084715A2009-04-23
JPH08105192A1996-04-23
JPS61163842U1986-10-11
Attorney, Agent or Firm:
Mitsuo Kata
Hiroshi Sanaka