SPUTTERING DEVICE AND FILM DEPOSITION METHOD BY SPUTTERING

Title:

SPUTTERING DEVICE AND FILM DEPOSITION METHOD BY SPUTTERING

Document Type and Number:

Japanese Patent JP2007162054

Kind Code:

A

Abstract:

To provide a sputtering device where discharge impedance is fixedly held, and film thickness control at high precision is made possible, and to provide a film deposition method by sputtering.

A sputtering device where a film deposition chamber is provided with a target, and a film is deposited on a substrate held to a substrate holder confronted with the target in the film deposition chamber by sputtering is composed in such a manner that, to the front in the direction of the substrate in the target 1-2, a shielding member 1-5 with the potential same as that of the substrate disturbing the progress of electrons jumping out of the target is located.

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Inventors:

UCHIDA KAZUE
ANDO KENJI
KANAZAWA HIDEHIRO
TERANISHI KOJI
IMAI TAKAKO
MIURA TAKAYUKI

Application Number:

JP2005358034A

Publication Date:

June 28, 2007

Filing Date:

December 12, 2005

Export Citation:

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Assignee:

CANON KK

International Classes:

C23C14/34; G02B5/26; G02B5/28

Attorney, Agent or Firm:

Tatsuya Nagao

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