To provide a sputtering system where, when depositing a film by sputtering, the need of performing maintenance of a vacuum tank under release to the air can be reduced, and stabilization of a film deposition process can be attained.

In the sputtering system where a sputtering gas is introduced into an evacuated chamber, and the film is deposited on a substrate by sputtering owing to the application of electric power, when depositing the film, a target used for the film deposition is functioned as a cathode, and further, a metal target provided at a position different from the position of the target used for the film deposition and not used for the film deposition is functioned as an anode so as to perform the film deposition.