Title:
スパッタリング装置
Document Type and Number:
Japanese Patent JP7193369
Kind Code:
B2
Abstract:
To provide a sputtering device capable of uniformly depositing in a face of a film thickness distribution with excellent symmetric coverage.SOLUTION: A sputtering device SM includes: a stage 4 for holding a substrate Sw with off set from a target center Tc; driving means for rotating and driving a the stage; and a collimator Cm having a plurality of openings 61 provided between a substrate Sw and a target 2. An opening having an X-axis direction length shorter than a half of a distance between centers between a substrate center Sc and a target center is a first opening 61, and an opening having an X-axis length not less than the distance between centers is a second opening 61, and an origin opening 61extends symmetrically to an X-axis in an X-axis minus direction while one end in a length direction located on a substrate center, and a plurality of first openings exist adjacent to the origin opening in the X-axis minus direction, while the first opening located on one end in the X-axis minus direction straddles the target center, and the second opening exists adjacent to the first opening in the X-axis minus direction straddling over the target center.SELECTED DRAWING: Figure 2
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Inventors:
Keiichiro Asakawa
Application Number:
JP2019022631A
Publication Date:
December 20, 2022
Filing Date:
February 12, 2019
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/34
Domestic Patent References:
| JP7113169A | ||||
| JP6456010B1 | ||||
| JP9500690A | ||||
| JP10176267A |
Attorney, Agent or Firm:
Seika Patent Attorney Corporation