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Title:
SPUTTERING TARGET, AND SPUTTERING APPARATUS AND SPUTTERING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2013241646
Kind Code:
A
Abstract:

To provide a sputtering target capable of attaining high-quality film formation with high productivity by reducing contamination and abnormal electrical discharge due to nodule.

A rotary cylindrical sputtering target (20) includes a plurality of target pieces (22a, 22b) bonded to the periphery of a backing tube (60) while leaving a gap (52a) each between the adjacent target pieces (22a, 22b) in the axial direction. The gap (52a) has a straight section (95) which extends from the outer periphery of the target pieces (22a, 22b) toward the backing tube (60), and a tapered section (94) which is positioned between the straight section (95) and the backing tube (60) with an inclination (θ) in the longitudinal direction of the straight section (95).


Inventors:
HAYATA HIROSHI
Application Number:
JP2012115155A
Publication Date:
December 05, 2013
Filing Date:
May 21, 2012
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
C23C14/34
Domestic Patent References:
JP2008184640A2008-08-14
JP2003027227A2003-01-29
JPH07228967A1995-08-29
Foreign References:
WO2012036079A12012-03-22
WO2010035718A12010-04-01
Attorney, Agent or Firm:
Morimoto International Patent Office