Title:
SPUTTERING TARGET MATERIAL
Document Type and Number:
Japanese Patent JP2015129323
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sputtering target material capable of suppressing exfoliation of a re-deposited film deposited on the sputtering target material or a backing plate etc., during deposition by sputtering.SOLUTION: A sputtering target material has one or two or more continuous or discontinuous grooves 3 having a depth of 0.01 mm or more and 1.0 mm or less and a width of 0.01 mm or more and 2.0 mm or less, on a target 1 surface including a backing plate 2. Further, the sputtering target material has two or more grooves 3 formed thereon, and has such a groove interval that the interval between each groove is 0.01 mm or more and 10 mm or less.
Inventors:
HAYASHI RYOJI
HASEGAWA HIROYUKI
HASEGAWA HIROYUKI
Application Number:
JP2014000760A
Publication Date:
July 16, 2015
Filing Date:
January 07, 2014
Export Citation:
Assignee:
SANYO SPECIAL STEEL CO LTD
International Classes:
C23C14/34
Attorney, Agent or Firm:
Shiina Akira
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