Title:
STORAGE METHOD OF CHIP PACKAGE AND PROCESSING METHOD OF PACKAGE SUBSTRATE
Document Type and Number:
Japanese Patent JP2022064087
Kind Code:
A
Abstract:
To provide a new technique for storing a plurality of chip packages formed by dividing a package substrate, into a tubular container.SOLUTION: A storage method for storing a plurality of chip packages 15 in a tubular container 72 having an opening 72b at least at one end includes: an alignment step of placing a chip package 15 and aligning the plurality of chip packages 15 in a row along a first direction on a tiltable chip mounting portion 74c; a tubular container connecting step of connecting the opening 72b of the tubular container 72 to the chip mounting portion 74c in the first direction before or after performing the alignment step; and a storage step of tilting the chip mounting portion 74c and the tubular container 72 such that the tubular container 72 is below the chip mounting portion 74c, and continuously sliding the plurality of chip packages 15 into the tubular container 72 to store the plurality of tip packages 15 after performing the alignment step and the tubular container connecting step.SELECTED DRAWING: Figure 4
Inventors:
YUU REN CHE
MIKE ANN
EDWIN TAI
MIKE ANN
EDWIN TAI
Application Number:
JP2020172603A
Publication Date:
April 25, 2022
Filing Date:
October 13, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/677; B23Q7/08; B24B27/06; B24B41/06; B65D85/90; B65G11/02; H01L21/301; H01L21/673; H01L21/68
Attorney, Agent or Firm:
Hiroshi Ogami
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