Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
STREOSCOPIC ARRAYING CIRCUIT
Document Type and Number:
Japanese Patent JPS6273751
Kind Code:
A
Abstract:

PURPOSE: To eliminate a conventional printed circuit board by arraying three- dimensionally a regular hexagonal package group of the same size containing circuit elements while holding them in a predetermined electric connection.

CONSTITUTION: Four types of basic packages including a 2-terminal package, a 3-terminal package, a short package and a dummy package are sterescopically arrayed in a predetermined sequence on an insulating substrate, and an electric circuit of an object is assembled. For example, when an electric circuit of a circuit diagram shown is assembled, five 2-terminal packages A containing resistors R1∼R4 and capacitor C, a 3-terminal package B containing a transistor TR, a short package C and two dummy packages are stereoscopically arrayed on the insulating substrate. The short package C achieves the function of node N in the electric circuit to electrically connect the base terminal of the transistor TR, one terminal of the capacitor C and one terminal of the resistors R1, R2 being built-in in each package of the steroscopic array.


Inventors:
SASAKI TADASHI
Application Number:
JP21423385A
Publication Date:
April 04, 1987
Filing Date:
September 27, 1985
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON DENKI HOME ELECTRONICS
International Classes:
H01L27/00; H05K1/00; H05K1/14; (IPC1-7): H01L27/00
Attorney, Agent or Firm:
Sakurai Toshihiko