Title:
STRUCTURE OF CONDUCTOR CONNECTING EDGE OF FLEXIBLE PRINTED BOARD
Document Type and Number:
Japanese Patent JP3408900
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent defective brazing and to enhance insulating property by eliminating the scattering of solder when the dges of a plurality of conductors formed on a flexible printed board are connected to a plurality of terminal parts of electronic components and an ink-jet recorder by brazing.
SOLUTION: A plurality of conductors 22 are formed on a base film 21 at a minute pitch. The edges of a plurality of the conductors are connected to a plurality of terminal parts 16a of a recording head 14 of an ink-jet recorder, respectively. In this constitution, slits 21a are formed between the edges of a plurality of the conductors among the edges of the base film 21. The gas which is generated in brazing is discharged through the slits 21a. Thus, the defective brazing caused by the scattering of the fused solder and the like is prevented.
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Inventors:
Nobuo Aoki
Application Number:
JP21665395A
Publication Date:
May 19, 2003
Filing Date:
August 01, 1995
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B41J2/01; H05K1/02; H05K1/11; H05K3/34; H05K3/36; (IPC1-7): H05K3/34; B41J2/01; H01R12/28; H05K1/02; H05K1/11
Domestic Patent References:
| JP710965U |
Attorney, Agent or Firm:
Toshio Okamura