To mount electronic components at arbitrary positions on a board by using heat-shrinkable tubes.

The structure for mounting the electronic component 3 includes the electronic component 3 attached on the board 1, seats 5 arranged in positions that surround the electronic component 3, and the heat-shrinkable tubes 6 arranged in positions that surround the electronic component 3. The heat-shrinkable tubes 6 are thermally shrunk. By thermally shrinking the heat-shrinkable tube 6, the electronic component 3 and the seat 5 are fixed, and the seat 5 is brought into pressure contact with the board 1. Thereby, the electronic component 3 is supported by the seat 5 and the heat-shrinkable tube 6, and attached on the board 1. The electronic components 3 can be mounted at arbitrary positions on the board 1 by using heat-shrinkable tubes 6, without any limitation by the mounting position of the electronic component 3.