Title:
Substrate Les double-sided pressure sensitive adhesive sheet
Document Type and Number:
Japanese Patent JP6091202
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate-less double-sided adhesive sheet having good antistatic property and release property and having an oligomer sealing performance in a release film itself, to be used as a member of a capacitive touch panel.SOLUTION: The substrate-less double-sided adhesive sheet includes release films having different levels of peeling force from each other, respectively laminated on both surfaces of an adhesive layer. Both release films comprise a polyester film, a coating layer containing a conductive compound and a binder polymer formed on the polyester film, and a release layer formed on the coating layer.
Inventors:
Tomohisa Saito
Kimihiro Izaki
Kimihiro Izaki
Application Number:
JP2012274252A
Publication Date:
March 08, 2017
Filing Date:
December 17, 2012
Export Citation:
Assignee:
Mitsubishi Plastics Co., Ltd.
International Classes:
C09J7/00; B32B27/00; B32B27/18; B32B27/36; C09J201/00
Domestic Patent References:
| JP2011230435A | ||||
| JP2003177241A | ||||
| JP2007152930A | ||||
| JP2012140008A | ||||
| JP2005153250A | ||||
| JP2011201118A | ||||
| JP2010017931A | ||||
| JP2007297565A | ||||
| JP2012184327A |
Foreign References:
| WO2011055689A1 |
Previous Patent: Incorrect connection prevention device
Next Patent: MULTISPINDLE MEASURING INSTRUMENT
Next Patent: MULTISPINDLE MEASURING INSTRUMENT