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Title:
SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2011249731
Kind Code:
A
Abstract:

To provide a substrate connection structure and an electric device capable of securing cooling performance to a device while saving space.

The substrate connection structure connects a plurality of circuit boards and includes: the plurality of circuit boards; a connection substrate arranged horizontally to a passage of cooling air discharged from an air blowing part to connect the circuit boards to each other; and a connector part which connects each of the plurality of circuit boards to the connection substrate. Each of the circuit boards and the connection substrate are arranged on the same plane.


Inventors:
WAKAYAMA NOBUHIKO
KAWADA ATSUMI
TAKAHIRA MITSURU
Application Number:
JP2010124324A
Publication Date:
December 08, 2011
Filing Date:
May 31, 2010
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H05K1/14; H05K7/14; H05K7/20
Domestic Patent References:
JPH11298179A1999-10-29
JPH10107470A1998-04-24
JPH11312854A1999-11-09
JPH0690072A1994-03-29
JPH11298179A1999-10-29
JPH10107470A1998-04-24
JPH11312854A1999-11-09
Attorney, Agent or Firm:
Polaire Patent Business Corporation



 
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