Title:
SUBSTRATE DRYING METHOD AND SUBSTRATE DRYING DEVICE THEREOF
Document Type and Number:
Japanese Patent JP3544618
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To effectively remove processing liquid sticking on a substrate, without causing the processing liquid to re-stick.
SOLUTION: A wafer W is held horizontally and rotated by a spin chuck 1. In order to dry the wafer W, the spin chuck 1 is rotated slowly, while rinse liquid is supplied from a surface nozzle N1. Consequently, a large drop 50 of liquid is grown on the main surface Wa of the wafer W. Then when the rinse liquid is stopped from being supplied from the surface nozzle N1, the drop 50 of liquid moves slowly toward the peripheral edge of the wafer W due to the slow rotation of the spin chuck 1 and is removed outward away from it. Then the spin chuck 1 is rotated fast to shake the water off from the surface of the wafer W and dry it.
Inventors:
Katsuhiko Miya
Akira Izumi
Akira Izumi
Application Number:
JP9186298A
Publication Date:
July 21, 2004
Filing Date:
April 03, 1998
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
F26B11/08; H01L21/304; (IPC1-7): H01L21/304; F26B11/08
Domestic Patent References:
| JP7211686A | ||||
| JP8195375A | ||||
| JP9146079A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Mio Kawasaki