Title:
SUBSTRATE GRINDING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2001113446
Kind Code:
A
Abstract:
To provide a method and a device for grinding a substrate allowing to perform grinding with preventing crack of the substrate even when the substrate is ground to be thin.
Scribe treatment is carried out against the substrate 11 from one principal plane side thereof to form a scribe groove 12. A protective tape 13 as a protective material is affixed on the other principal plane of the scribed substrate 11 to grind the substrate 11 from the principal plane side of the scribed substrate 11.
Inventors:
SAKAMOTO OSAMU
Application Number:
JP29235999A
Publication Date:
April 24, 2001
Filing Date:
October 14, 1999
Export Citation:
Assignee:
SONY CORP
International Classes:
B24B7/04; H01L21/304; (IPC1-7): B24B7/04; H01L21/304
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