Title:
SUBSTRATE HOLDING DEVICE AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3693448
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate grasping device which can supply a pure fluid having no risk of contaminating a work to be polished to the area between a top ring and the work.
SOLUTION: The arrangement according to the present invention is configured with a top ring 10 to grasp a substrate in such a way as confronting a turntable, a driven shaft 12 to support the top ring through a spherical bearing in such a way as capable of tilting, and a transmission mechanism 72 which is installed between the end of drive shaft and the top ring 10 and transmits thereto 10 a torque from the drive shaft 12, wherein the shaft hole 50 is formed in the center of the drive shaft so as to admit insertion of a flowing pipe 56 whose one end is in communication with an external device such as a fluid source and other end is in communication to between the top ring 10 and a work to be polished.
Inventors:
Norio Kimura
Toshiya Takeuchi
Toshiya Takeuchi
Application Number:
JP3551097A
Publication Date:
September 07, 2005
Filing Date:
February 04, 1997
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/04; B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP8300253A | ||||
| JP5069314A | ||||
| JP8187660A | ||||
| JP64016260U |
Attorney, Agent or Firm:
Isamu Watanabe
Shintaro Hotta
Susumu Ohata
Shintaro Hotta
Susumu Ohata
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