Title:
SUBSTRATE FOR INTEGRATED PARTS CONSTITUTED OF THIN FILM AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH07263291
Kind Code:
A
Abstract:
PURPOSE: To provide a thin film substrate sufficiently rugged to form integrated parts and a method for manufacturing it without damaging it. CONSTITUTION: A thin film substrate has a support structure 1 and a nonconductive thin film 5 for forming integrated parts placed on the support structure 1, furthermore an intermediate film 3 capable of being chemically etched between the support structure 1 and the thin film 5. At least one chemical etching channel crosses the intermediate film 3.
Inventors:
MISHIERU BURIYUERU
BEATORISU BIASU
BEATORISU BIASU
Application Number:
JP1097995A
Publication Date:
October 13, 1995
Filing Date:
January 26, 1995
Export Citation:
Assignee:
COMMISSARIAT ENERGIE ATOMIQUE
International Classes:
H01L21/02; H01L21/68; (IPC1-7): H01L21/02
Attorney, Agent or Firm:
Akira Asamura (3 outside)