Title:
SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006135090
Kind Code:
A
Abstract:
To provide a method of manufacturing a substrate in which a pattern that is relatively wide and has a large film thickness can be formed by a liquid-drop discharge method.
The manufacturing method manufactures a substrate (10) having a patterned functional film. The method comprises the steps of forming a groove pattern (12) on the substrate (10) by laser irradiation (11), disposing a liquid material (13) along the groove pattern (12), and heating the liquid material (13) to form the functional film. In addition, the groove pattern (12) may be combined with a liquid-repellent film (14). The liquid material can be used to form a high-density fine functional film (e.g. wiring pattern) on the substrate.
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Inventors:
UMETSU KAZUNARI
Application Number:
JP2004322619A
Publication Date:
May 25, 2006
Filing Date:
November 05, 2004
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H05K3/10; G09F9/00; H01L51/50; H05B33/02; H05B33/10; H05K3/28
Attorney, Agent or Firm:
Yoshiyuki Inaba
Katsuro Tanaka
Shinji Oga
Katsuro Tanaka
Shinji Oga