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Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE HOLDING BODY, SUBSTRATE HOLDER, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015185579
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve film thickness uniformity between substrates and/or improve film thickness uniformity within a substrate surface.SOLUTION: The substrate processing apparatus includes: a plurality of ring-shaped substrate holders on each of which a processing substrate is placed; a substrate holding body at least one substrate holder of which has a ring width different from ring widths of the other substrate holders among the plurality of substrate holders; a processing chamber for accommodating the substrate holding body; a gas supply part for supplying the processing chamber interior with a process gas; and an exhaust part for exhausting the processing chamber interior.

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Inventors:
MIZUNO KANEKAZU
JIZO HISASHI
KOTAKE SHIGERU
MINAMI MASAKATSU
Application Number:
JP2014058281A
Publication Date:
October 22, 2015
Filing Date:
March 20, 2014
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/683; H01L21/31



 
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