SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM WITH SUBSTRATE PROCESSING PROGRAM RECORDED THEREIN

Japanese Patent JP2015113523

A

PROBLEM TO BE SOLVED: To enable a processing fluid for processing substrates to be stably supplied only by a prescribed flow rate by heating the processing fluid to a prescribed temperature.SOLUTION: A substrate processing apparatus includes: one or more substrate processing units (11-18) each processing a substrate (3) with a processing fluid; processing fluid supply units (19, 20) for supplying the heated processing fluid to the substrate processing units (11-18); and a controller (21) for controlling the processing fluid supply units (19, 20). The processing fluid supply units (19, 20) include a storage tank (35) for storing the processing fluid; a heating heat exchanger (51) for heating the processing fluid; and a supply path (52) for supplying the processing fluid to the one or more substrate processing units (11-18). The supply path (52) includes a bypass path (71) for bypassing the heating heat exchanger (51) at an upstream of the substrate processing units (11-18). The processing fluid heated by the heating heat exchanger (51) and the processing fluid supplied from the bypass path (72) are mixed and the mixed processing fluid is supplied to the substrate processing units (11-18).

KAWAGUCHI YOSHIHIRO
KANEKO SATOSHI

JP2013259017A

June 22, 2015

December 16, 2013

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TOKYO ELECTRON LTD

C23C18/31; H01L21/304

JP2006066727A	2006-03-09
JP2005501964A	2005-01-20
JPH0375378A	1991-03-29
JP2013010994A	2013-01-17

Mihiro Uchino

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