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Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022030850
Kind Code:
A
Abstract:
To provide a technology to reduce the size of a substrate processing apparatus for supercritical drying.SOLUTION: A substrate processing apparatus replaces a liquid film formed on the upper surface of a horizontal substrate with a supercritical fluid and dries the substrate. The substrate processing apparatus includes a pressure vessel, a lid, and a support. The pressure vessel forms a drying chamber for the substrate inside. The lid closes the opening of the drying chamber. The support horizontally supports the substrate in the drying chamber. The support is fixed in the drying chamber.SELECTED DRAWING: Figure 5

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Inventors:
UMEZAKI SHOTA
INATOMI HIROAKI
Application Number:
JP2020135141A
Publication Date:
February 18, 2022
Filing Date:
August 07, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F26B5/14; H01L21/304; F26B9/00; F26B21/10
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito



 
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