To provide a substrate processing device in which vacuum transfer chambers and load lock chambers are efficiently arranged in a limited area and which can continue processing of a substrate even when one of the vacuum transfer chambers is unavailable.

Substrate transfer mechanisms 21 are provided in first and second vacuum transfer chambers 2A, 2B. Processing chambers 5 for performing vacuum processing on a substrate W are connected to the first and second vacuum transfer chambers 2A, 2B adjacently in a lateral direction. A load lock chamber 3A is interposed between the first and second vacuum transfer chambers 2A, 2B, and partition valves G1, G2 are respectively provided between the load lock chamber 3A and normal pressure atmosphere on the upper side and between the load lock chamber 3A and the first and second vacuum transfer chambers 2A, 2B, in the load lock chamber 3A. A substrate mounting part 31 which is provided in the load lock chamber 3A and on which the substrate W is mounted moves vertically between the upper position on which the substrate W is delivered between the load lock chamber 3A and the normal pressure atmosphere and the lower position on which the substrate is delivered between the load lock chamber 3A and the first and second vacuum transfer chambers 2A, 2B.