Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7163199
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a first atmosphere control system configured to control an atmosphere inside a processing zone of a substrate processing area and a second atmosphere control system configured to control an atmosphere inside a substrate transfer zone of the substrate processing area. The first atmosphere control system supplies, when a liquid processing is performed in a liquid processing unit, an atmosphere control gas to the corresponding liquid processing unit by a first gas supply, and discharges an atmosphere inside the corresponding liquid processing unit by a first gas discharge unit. The second atmosphere control system circulates an atmosphere adjustment gas in a circulation system of the corresponding second atmosphere control system, and discharges an atmosphere inside the circulation system of the second atmosphere control system when at least one of the liquid processing unit is opened to the substrate transfer zone.
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Inventors:
Daisuke Aoki
Junya Minanda
Yasunori Toyoda
Junya Minanda
Yasunori Toyoda
Application Number:
JP2019001269A
Publication Date:
October 31, 2022
Filing Date:
January 08, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; H01L21/027; H01L21/677
Domestic Patent References:
| JP2013206957A | ||||
| JP2006216803A | ||||
| JP2004311940A | ||||
| JP2003229355A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Nakamura Yukitaka
Satoru Asakura
Hideyuki Mori
Nakamura Yukitaka
Satoru Asakura
Hideyuki Mori
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