Title:
SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2022012610
Kind Code:
A
Abstract:
To efficiently perform substrate processing even if a substrate is peeled.SOLUTION: A first step electrostatically attracts a substrate to a mounting stand. A second step starts plasma processing of a plasma processing step for the substrate after the first step. A third step detects peeling of the substrate from the mounting stand after the second step. A fourth step stops processing of the plasma processing step and stores a lapsed time of plasma processing when peeling of the substrate is detected. A fifth step cancels electrostatic attraction and removes electricity from the mounting stand after the fourth step. A sixth step electrostatically attracts the substrate to the mounting stand again after the fifth step. A seventh step restarts the plasma processing step and performs plasma processing during a processing residual time obtained by subtracting the lapsed time of plasma processing from a set processing time after the sixth step. An eight step subsequently performs processing after plasma processing along a process recipe after the seventh step.SELECTED DRAWING: Figure 4
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Inventors:
OSAWA HIDEKAZU
Application Number:
JP2020114559A
Publication Date:
January 17, 2022
Filing Date:
July 02, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/3065; H01L21/683
Attorney, Agent or Firm:
Sakai International Patent Office