Title:
基板処理方法
Document Type and Number:
Japanese Patent JP6896447
Kind Code:
B2
Abstract:
Disclosed is a substrate treating method for treating a substrate with a directed self-assembly material applied thereto. The substrate treating method includes a heating step and a cooling step. The heating step includes heating the substrate to perform phase separation of the directed self-assembly material by maintaining an interior of a treatment container in a non-oxidizing gas atmosphere and placing the substrate at a heating position. The cooling step includes cooling the substrate by maintaining the interior of the treatment container in the non-oxidizing gas atmosphere, placing the substrate at a cooling position further away from the heating unit than the heating position, supplying non-oxidizing gas into the treatment container, and exhausting gas within the treatment container.
Inventors:
Fukumoto Yasuhiro
Yuji Tanaka
Tomohiro Matsuo
Takeharu Ishii
Yuji Tanaka
Tomohiro Matsuo
Takeharu Ishii
Application Number:
JP2017025230A
Publication Date:
June 30, 2021
Filing Date:
February 14, 2017
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027
Domestic Patent References:
| JP2016518701A | ||||
| JP2002324790A | ||||
| JP2014087781A |
Foreign References:
| US20140273523 | ||||
| KR1020150127645A | ||||
| US20150228512 |
Attorney, Agent or Firm:
Tsutomu Sugiya
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname
Nobuyoshi Aono
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname
Nobuyoshi Aono