Title:
SUBSTRATE PROCESSING SYSTEM AND METHOD FOR PROCESSING SUBSTRATE
Document Type and Number:
Japanese Patent JP3589406
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To measure the film thickness of a resist film coating a wafer by a peripheral exposure apparatus inside a substrate processing system.
SOLUTION: In a peripheral exposure apparatus 51 inside a coating development processing system 1, the film thickness of a resist film on a wafer W by providing a film thickness sensor 64 that senses the film thickness of the resist film by laser beam and moving the wafer W on a loading stand 61 in the X direction.
Inventors:
Yuji Fukuda
Kunie Ogata
Kunie Ogata
Application Number:
JP2000315295A
Publication Date:
November 17, 2004
Filing Date:
October 16, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01B11/02; G01B11/06; G03F7/20; G03F7/26; G03F7/38; H01L21/027; (IPC1-7): H01L21/027; G01B11/02; G01B11/06; G03F7/20; G03F7/26; G03F7/38
Domestic Patent References:
| JP63031116A | ||||
| JP10247621A | ||||
| JP9106075A | ||||
| JP6061140A | ||||
| JP4035018A |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Miaki Kametani
Koji Hagiwara
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