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Title:
基板処理システム
Document Type and Number:
Japanese Patent JP7361865
Kind Code:
B2
Abstract:
A substrate processing apparatus configured to perform a drying processing of drying substrates by using a processing fluid in a supercritical state includes a processing vessel and multiple holders. In the processing vessel, the drying processing is performed. The multiple holders are respectively configured to hold the substrates within the processing vessel.

Inventors:
Hiroro Inatomi
Satoshi Loquat
Satoshi Okamura
Application Number:
JP2022168071A
Publication Date:
October 16, 2023
Filing Date:
October 20, 2022
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; F26B5/04; H01L21/677
Domestic Patent References:
JP2013254906A
JP2013033963A
JP2009038328A
JP2017201219A
JP2004079859A
JP2013080908A
Attorney, Agent or Firm:
Sakai International Patent Office



 
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