Title:
SUBSTRATE TRANSFER DEVICE, SUBSTRATE PROCESSOR, AND PLACING PEDESTAL
Document Type and Number:
Japanese Patent JP3971601
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate transfer device capable of obtaining a high throughput.
SOLUTION: A loader 10 comprises an accommodation part 20 for accommodating FOUP (hermetically sealing accommodation vessel), an opener 40 for carrying out a substrate from the FOUP, and a carrying robot 30 for carrying the FOUP between the accommodation part 20 and the opener 40. When the substrate is carried in the opener 40, the FOUP is mounted on a mounting table 41. The mounting table 41 is formed with a notch 43 in which a carrying arm 35 of the carrying robot 30 can pass along a vertical direction. For this reason, the carrying arm 35 which holds the FOUP passes the notch 43 from above, thereby transferring directly the FOUP to the mounting table 41, and a time required for transfer operations of the FOUP is shortened and a high throughput can be obtained.
Inventors:
光▲吉▼ 一郎
Application Number:
JP2001362064A
Publication Date:
September 05, 2007
Filing Date:
November 28, 2001
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B65G1/04; H01L21/677; B65G1/14; B65G49/07; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65G1/04; B65G1/14; B65G49/07
Domestic Patent References:
| JP2000260848A | ||||
| JP11297792A | ||||
| JP9283599A |
Attorney, Agent or Firm:
Shigeaki Yoshida
Yoshitake Hidetoshi
Takahiro Arita
Yoshitake Hidetoshi
Takahiro Arita
Previous Patent: FERROELECTRIC MATERIAL CAPACITOR AND SEMICONDUCTOR DEVICE
Next Patent: HIGH-STRENGTH SPRING STEEL
Next Patent: HIGH-STRENGTH SPRING STEEL