To provide a substrate transfer method and a substrate transfer apparatus for sufficiently transferring a heated substrate to a predetermined table without damages.

A substrate transfer method: making a work by bonding a wafer molded by molding a plurality of chips arranged in lines planarly by a resin to a support plate via a double-sided adhesive tape which has a heat-peelable adhesive layer on one side; heating, after performing intended processing on the work, the work on a first table for separating the support plate by a support plate separation device; and transferring the wafer by sucking and holding an outer peripheral part of a front face of the wafer with a suction head, after being separated from the double-sided adhesive tape, which has the resin being softened. During the transferring period, an atmospheric pressure in the suction head depending on deviation of a rear face of the wafer.