To provide a substrate treating apparatus into which a substrate can be transferred without displacement and to provide a substrate treating method.

The substrate treating apparatus 1 includes an etching treating chamber 14 including sensors 21, 22 for detecting the relative position between the etching treating chamber 14 and a wafer transferring mechanism 23, a control unit 38 for correcting displacement, a motor controller 39, a motor 28, and a motor 30. Since the displacement of a wafer W can be corrected, the wafer transferring mechanism 23 can transfer the wafer W into the etching treating chamber 14 without displacement and can place the wafer W on a holding table 19 in place.