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Patent Searching and Data


Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2006190892
Kind Code:
A
Abstract:

To provide a substrate treatment apparatus for adjusting exhaust in a plurality of treatment units easily.

A plurality of treatment units 41-44 are arranged in lamination and form a two-storied structure. The treatment units 41, 43 on a first floor are connected to an exhaust vessel 61 via exhaust ducts 51, 53 having the same path lengths. The treatment units 42, 44 on the second floor are connected to an exhaust vessel 62 via exhaust ducts 52, 54 having the same path lengths. The exhaust vessel 61 is arranged in lamination on the exhaust vessel 62, and internal spaces communicate with one another via a communication path 70. A damper mechanism 71 is arranged at the communication path 70. The exhaust vessel 62 is connected to an exhaust source 67 via a main exhaust pipe 66.


Inventors:
OKUNO EIJI
Application Number:
JP2005002783A
Publication Date:
July 20, 2006
Filing Date:
January 07, 2005
Export Citation:
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Assignee:
DAINIPPON SCREEN MFG
International Classes:
H01L21/027; F24F7/06
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki