Title:
SUCTION HEAD FOR TAKING OUT MOLDING
Document Type and Number:
Japanese Patent JP3686597
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To use a suction head for both a usual molding and a thin-wall molding by adopting a suction adaptor for the thin-wall molding having a flat suction surface for a usual suction head and attaching/detaching the suction adaptor.
SOLUTION: A suction pad 2 having a suction part 21 in the shape of a truncated cone and a suction hole 24 in the middle of the inside is fitted to the tip of the suction head 1. The suction adaptor 8 having a suction board 83 of a flat surface which has an outside diameter to be housed in the opening fringe of the suction part 21 and in which a plurality of suction holes 82 are bored in the middle part at one end of a hollow shaft part 81 engaging with the suction hole 24 and a fitting flange 84 at the other end is provided freely attachably/detachably in the suction part 21 to suck the thin-wall molding such as a card.
Inventors:
Kazumasa Kobayashi
Application Number:
JP2001199508A
Publication Date:
August 24, 2005
Filing Date:
June 29, 2001
Export Citation:
Assignee:
Nissei Plastic Industry Co., Ltd.
International Classes:
B29C45/42; (IPC1-7): B29C45/42
Domestic Patent References:
| JP7267410A | ||||
| JP64036350U |
Attorney, Agent or Firm:
Teruo Akimoto
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