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Patent Searching and Data


Title:
SUPERCONDUCTING MATERIAL
Document Type and Number:
Japanese Patent JPS6472409
Kind Code:
A
Abstract:

PURPOSE: To improve bonding strength of a coating film and to prevent chemical reaction of the coating film with a cupper basic material by forming a basic material made of Ni based alloy between the coating film made of a superconducting material and the cupper basic material.

CONSTITUTION: A cupper basic material 1 is set in a vacuum vessel 6 of a plasma spray coating device 4, a mixture gas is continuously supplied to a spray coating nozzle 7, and power is supplied between the nozzle 7 and an electrode 8 from a power source 9 to reduce the gas pressure in the vessel 6, forming a basic material 2 made of Ni on a basic material 1. Next, superconducting powder made of Y0.3Ba0.7Cu, O3-y is supplied to form a superconducting coating film 3 on the basic material 2. Then, a superconducting material 10 composed of the basic materials 1, 2 and the coating film 3 is taken out of the vessel 6, heated, and cooled to a room temperature in the atmosphere to produce a plate-like superconducting material.


Inventors:
TACHIKAWA KYOJI
KOSUGE SHIGECHIKA
KABASAWA MAKOTO
MATSUDA MINORU
SHINPO YUKIO
WATANABE ITARU
Application Number:
JP22912387A
Publication Date:
March 17, 1989
Filing Date:
September 12, 1987
Export Citation:
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Assignee:
UNIV TOKAI
NIPPON KOKAN KK
International Classes:
H01L39/24; H01B12/06; H05K1/09; (IPC1-7): H01B12/06; H01L39/24; H05K1/09
Domestic Patent References:
JPS63304529A1988-12-12
Attorney, Agent or Firm:
Natsuo Shiotani