To provide a surface acoustic wave device in which wire connecting reliability is assured and to provide a method of manufacturing the same.

In the surface acoustic wave device in an electronic part (e.g., a SAW device 10) housed in a package having a stem 1a in the state that a SAW element chip 110 is in a face-up state, the average roughness Ra10 of the surface of a wire bonded electrode pad 4 is set to 0.1 to 0.4 μm. Thus, the surface of the electrode pad 4 is made a relatively smooth surface, and thereby, the contact surface of a metal wire 7 with the electrode pad 4 can be secured sufficiently, and the yield at the bonding can be set to a high value of 94.5% or more. Further, the average roughness Ra10 of the surface of the electrode pad 4 is set to 0.3 μm or less, and thereby the yield of about 100% can be attained.