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Title:
SURFACE ACOUSTIC WAVE PROTECTING METHOD
Document Type and Number:
Japanese Patent JPH04120810
Kind Code:
A
Abstract:

PURPOSE: To prevent the adherence of foreign matters and the occurrence of scratches for a surface acoustic wave SAW element in its assembling or packaging state by attaching a protecting cover right after the formation of an SAW electrode.

CONSTITUTION: An SAW element which generates the deflected or modulated radiated laser light 10 is obtained by making an SAW 6 affect colinearly or coplanarly the incident laser light 9. Meanwhile a protecting cover 11 is attached with use of a solvent 12 having the refractive index smaller than that of an optical waveguide 2 together with viscoelasticity. A contact is secured between an SAW electrode 3 and the traveling part of the SAW 6 and a gap 16 formed by the center recess part of the cover 11. As a result, the generation and the traveling of the SAW are never hindered and furthermore the periphery of the recess part is shut off from the outside by the cover 11 and the applied solvent 12. Thus it is possible to prevent the adherence of foreign matters and the occurrence of scratches for the SAW element in its assembling or packing state.


Inventors:
SHIBA MASATAKA
INAGAKI AKIRA
YOSHIDA MINORU
ITOU AKITOMO
KAWAMOTO KAZUTAMI
Application Number:
JP23990890A
Publication Date:
April 21, 1992
Filing Date:
September 12, 1990
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H03H9/25; G02F1/125; (IPC1-7): H03H9/25
Attorney, Agent or Firm:
Junnosuke Nakamura (1 outside)



 
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