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Title:
SURFACE MODIFICATION DEVICE AND SURFACE MODIFICATION METHOD
Document Type and Number:
Japanese Patent JP2012144765
Kind Code:
A
Abstract:

To surely prevent hard particles for modifying a surface of a workpiece from scattering to the circumference while smoothly and surely supplying the particles to an area in which the processing of the workpiece is performed.

A rotary tool 2 is disposed oppositely to the surface of the round bar-like workpiece 1 through a minute gap, the workpiece 1 is longitudinally moved while being rotated around an axis, and during that time, dispersion liquid 6 with hard particles 6a dispersed therein is supplied from a dispersion liquid supply pipe 12 through which the rotary tool 2 is inserted through a circulation pipe 19 while rotating the rotary tool 2, whereby the dispersion liquid 6 is supplied to between the outer circumferential surface of the workpiece 1 and a working surface 2a of the rotary tool 2 to modify the surface of the workpiece 1 by the pressing force of the hard particles 6a.


Inventors:
SAKURAI SHIGEYUKI
AKITA HIDEKI
Application Number:
JP2011003102A
Publication Date:
August 02, 2012
Filing Date:
January 11, 2011
Export Citation:
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Assignee:
HITACHI CONSTRUCTION MACHINERY
International Classes:
C23C24/02
Domestic Patent References:
JP2010172995A2010-08-12
JPH0499883A1992-03-31
JP2004034258A2004-02-05
Attorney, Agent or Firm:
Shunji Kagei
Kagei Keidai



 
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