Title:
接点部材、コネクタ、及び接点部材の表面改質方法
Document Type and Number:
Japanese Patent JP4154399
Kind Code:
B2
Abstract:
Spherical particles having curvatures larger than those of irregularities, crystal grain boundaries, lattice defects or the like (referred to collectively as irregularities, hereinafter) on the surface of a conductive metal material are ejected at high speeds to make the particles collide against the surface of the conductive metal material, thereby repeatedly causing rapid melting and cooling at the minute points of impact of the particles, thereby changing the surface into amorphous. Then, spherical particles having curvatures smaller than those of irregularities on the surface subjected to the treatment described above collide against the surface, thereby changing the surface into amorphous and planarizing the surface.
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Inventors:
Ryoji Karai
Masashi Okada
Masashi Okada
Application Number:
JP2005093851A
Publication Date:
September 24, 2008
Filing Date:
March 29, 2005
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
H01B5/14; H01R13/03; H01R43/16; C21D7/06; H01H1/06; H01H11/04
Domestic Patent References:
| JP2240212A |
Foreign References:
| WO2005007907A1 |
Attorney, Agent or Firm:
Taku Kusano
Naoki Nakao
Yukio Nakamura
Naoki Nakao
Yukio Nakamura
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