To provide an electronic circuit unit capable of preventing a mounting defect due to a tilt of a circuit board where a pedestal member is soldered.

The electronic circuit unit 1 is surface-mounted on a mother board 20 and used, and the height position of the circuit board 2 where an electronic component 3 is mounted to the mother board 20 is regulated on the basis of the pedestal member 8. The pedestal member 8 is formed by punching a metal plate and beveled portions 8a and 8b are provided at circumferential edges of a top surface and a reverse surface of the pedestal member 8. The one beveled portion 8a is formed as an annular inclined surface by stamping and the other beveled portion 8b is formed as sag in punching. A group of first lands 5 and a group of second lands 6 are formed on a reverse surface of the circuit board 2; and the pedestal member 8 is soldered to each first land 5, and a solder ball 9 is added to each second land 6.