Title:
SURFACE MOUNTED SAW DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3915649
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve a problem of the upsizing of an individual piece of a circuit board because an interval between SAW (surface acoustic wave) chips is expanded to secure a space for connecting a conductive metallic film to an upper electrode for grounding and another problem of a deterioration in productivity in mass-production using a circuit board parent material.
SOLUTION: A surface mounted SAW device is provided with: a circuit board 2 provided with an external electrode 4 and an upper electrode 5; a SAW chip provided on its bottom surface with connection pads 16 subjected to flip chip mounting on the upper electrode through a conductor bump 10, and an IDT 17; resin 20 provided at least between the circuit board and the lower part of the SAW chip so as to form an airtight space S between the bottom surface of the SAW chip and the upper surface of the circuit board. The SAW device is further provided with: a conductive metallic film 21 covering the outer surface of the resin or the outer surfaces of the resin and SAW chip; and an exposure part 8 for grounding wherein the upper electrode for grounding or part of an internal conductor is exposed to the outside. The conductive metallic film is electrically connected to the exposure part for grounding.
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Inventors:
Onozawa Yasuhide
Application Number:
JP2002293105A
Publication Date:
May 16, 2007
Filing Date:
October 04, 2002
Export Citation:
Assignee:
Epson Toyocom Corporation
International Classes:
H03H9/25; H03H3/08; (IPC1-7): H03H9/25; H03H3/08
Domestic Patent References:
| JP7111438A | ||||
| JP2186662A | ||||
| JP2002290199A | ||||
| JP11055066A | ||||
| JP7099420A |
Foreign References:
| WO2002005424A1 |
Attorney, Agent or Firm:
Hitoshi Suzuki