To provide a surface plating device for metallic foil which can achieve homogeneous plating without allowing a plating solution to infiltrate to the rear surface side of a strip material.
The surface plating device for the metallic foil for continuously applying plating treatment to one surface of the strip material by moving the strip material impressed with voltage within a plating tank in which the plating solution is contained. The device is equipped with a guide belt wound around between a first roller arranged within the plating solution in the plating tank and a second roller arranged at the top end of the plating tank, an anode arranged to face the outer side of the guide belt, an inlet side conductor roll disposed above the plating tank, and an outlet side conductor roll disposed above the plating tank. After the strip material is deflected by the inlet side conductor roll, the strip material is held in tight contact with the guide belt along the same and is moved while being held opposite to the anode and since the plating treatment is applied only to the surface not in tight contact with the guide belt, the plating solution does not infiltrate to the rear surface side of the strip material and the homogeneous plating treatment can be achieved.
HAYASHI HIROYUKI
HAYASHI HIDENORI
YAMAUCHI SHIGEHARU
Shinichi Fukuda
Takemichi Fukuda