To provide a surface polishing device circulating and recycling a slurry used as a polishing liquid when a semiconductor wafer, a wafer with an insulating layer for a semiconductor circuit, a wafer with metallic wiring, a magnetic disc, a glass substrate, and other plate-like workpieces are surface-polished.

A polishing liquid collection tank 18 is disposed in the front side of liquid flow of a polishing liquid suction mechanism 5. A slurry S settled out at the bottom of the polishing liquid collection tank 18 is stored in a polishing liquid container 24 which is connected to the front side of the liquid flow of the polishing liquid collection tank 18. On the other hand, a supplementary polishing liquid supply mechanism 8 is disposed in the rear of the liquid flow of the polishing liquid container 24 supplying the polishing liquid in the polishing liquid container 24 to a machining surface of a disc type polishing tool 2.