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Title:
表面形状測定方法
Document Type and Number:
Japanese Patent JP7093915
Kind Code:
B2
Abstract:
To provide a surface shape measurement method capable of shortening whole measurement time.SOLUTION: A surface shape measurement method for measuring a surface shape of a measurement object P from brightness information of interference light obtained by an imaging part 16 while changing an optical path length of measurement light emitted to each point of a measured surface S includes: first light sources 40 and 240 for emitting white light for surface shape measurement; and a second light source 41 for emitting longer light of a coherence region than white light or a bandpass filter 243 for transmitting light having a narrow wavelength width. A surface shape measurement method and a surface shape measurement device include: an interference region acquisition step of acquiring an interference fringe at a longer image acquisition interval than an image acquisition interval in a surface shape measurement step using the long light of the coherence region; a scanning region determination step of determining a scanning range using brightness information of the acquired interference fringe; and a surface shape measurement step of measuring a surface shape within a scanning region determined in the scanning range determination step.SELECTED DRAWING: Figure 5

Inventors:
Hideki Morii
Application Number:
JP2021081714A
Publication Date:
July 01, 2022
Filing Date:
May 13, 2021
Export Citation:
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Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
G01B11/24; G01B9/02
Domestic Patent References:
JP2008292240A
JP2016031368A
JP2014228527A
JP2010237183A
Foreign References:
US20160027194
US8780334
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura