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Title:
SURFACE-TREATED INORGANIC FILLER, EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2002105239
Kind Code:
A
Abstract:

To provide an epoxy resin composition for a semiconductor sealing which has excellent moldability and soldering resistance.

This epoxy resin composition for semiconductor sealing is composed of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) a surface-treated inorganic filler of which the surface is treated with a compound having one or more epoxy resin groups in a molecule and with an organic aluminum compound.


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Inventors:
OTA MASARU
Application Number:
JP2000301843A
Publication Date:
April 10, 2002
Filing Date:
October 02, 2000
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K9/04; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08K9/04; C08G59/62; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
JPH10287796A1998-10-27



 
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