To provide a surface treatment agent for a metal, which forms a chemical conversion coating having superior heat resistance on the surface of a metallic conductive part; a printed wiring board having the chemical conversion coating formed on the surface of the metallic conductive part by bringing the surface of the metallic conductive part into contact with the surface treatment agent; and a method for manufacturing the printed wiring board by forming the chemical conversion coating on the surface of the metallic conductive part by bringing the surface of the metallic conductive part into contact with the surface treatment agent, and then soldering it with the use of a lead-free solder.
The surface treatment agent to be used when electronic parts or the like are soldered to the surface of the metallic conductive part composing a circuit section of the printed wiring board includes using different types of imidazole compounds in combination as an effective component of the surface treatment agent. The utilization of the surface treatment agent is also disclosed.
COPYRIGHT: (C)2008,JPO&INPIT
KIKUKAWA YOSHIMASA
MURAI TAKAYUKI
| JP2003031929A | 2003-01-31 | |||
| JP2002105662A | 2002-04-10 | |||
| JP2005226082A | 2005-08-25 |