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Patent Searching and Data


Title:
SUSPENSION BOARD WITH OUTER FRAME AND MANUFACTURING METHOD OF SUSPENSION BOARD WITH OUTER FRAME
Document Type and Number:
Japanese Patent JP2012014821
Kind Code:
A
Abstract:

To provide a suspension board with outer frame permitting precise continuity check on wiring included in the suspension board.

The suspension board with outer frame according to the invention comprises: a suspension board; and an outer frame that supports the suspension board from a tail side. The outer frame comprises: a metal support board; an insulation layer formed on the metal support board; and a conductor layer formed on the insulation layer. The conductor layer formed on the outer frame is enclosed by a conductor layer removed area where the conductor layer is removed and has a separation area for inspection which is separated from other area.


Inventors:
MURAKAMI KOICHI
MIURA YOICHI
ONUKI MASAO
Application Number:
JP2010200894A
Publication Date:
January 19, 2012
Filing Date:
September 08, 2010
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G11B21/21; G11B5/60; H05K1/05; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Akihiko Yamashita
Kishimoto Tatsuto