Title:
スイッチモジュール、及び、スイッチ装置
Document Type and Number:
Japanese Patent JP7085965
Kind Code:
B2
Abstract:
To provide a switch module and a switch device that enable good operation with a configuration that does not use solder.SOLUTION: A switch module includes a housing having a housing portion penetrating in a thickness direction between a first surface and a second surface, and fixed to a substrate having a fixed contact member, a movable contact member that is housed in the housing portion and is capable of coming into contact with and separating from the fixed contact member, and a cover sheet fixed to the first surface of the housing, and the housing includes a surrounding portion that is formed to project from the second surface, surrounds the housing portion in plan view, and has elasticity.SELECTED DRAWING: Figure 6
Inventors:
Hidetaka Sato
Application Number:
JP2018205095A
Publication Date:
June 17, 2022
Filing Date:
October 31, 2018
Export Citation:
Assignee:
Alps Alpine Co., Ltd.
International Classes:
H01H13/04; H01H9/02
Domestic Patent References:
| JP2003518717A | ||||
| JP2018101461A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito