Title:
TACKY ADHESIVE TAPE AND ITS APPLICATION
Document Type and Number:
Japanese Patent JP3739488
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prepare a tacky adhesive tape, having a tacky adhesive layer formed of an energy ray-hardening tacky component, an epoxy resin and a phenolic resin, capable of giving a cured article having high shock resistance, excellent in balance between a shear strength and a peel strength and useful for a silicone wafer, etc.
SOLUTION: This tacky adhesive tape has a tacky adhesive layer which is formed of (A) an energy ray (e.g. ultraviolet rays)-hardening tacky component such as an acrylic compound, (B) an epoxy resin made of bisphenol, etc., and (C) a phenolic resin, and preferably contains (D) a heat activation-type latent epoxy resin hardening agent and/or an epoxy resin hardening accelerator. Further, the component C is compounded with the component B at a ratio of epoxy group to phenolic hydroxyl group of 0.2-4. Furthermore, it is preferable that an IC-chip is pasted on the tacky adhesive layer of the tacky adhesive tape, the layer is irradiated with energy rays for fixing the IC-chip on the tacky adhesive layer. Subsequently, the IC-chip is loaded on a lead frame through the tacky adhesive layer, and then heated to adhere the IC-chip to the lead frame.
Inventors:
Hideo Seno
Takashi Sugino
Shun Note
Takashi Sugino
Shun Note
Application Number:
JP16482896A
Publication Date:
January 25, 2006
Filing Date:
June 25, 1996
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/02; C09J4/00; C09J133/00; C09J161/06; C09J163/00; H01L21/301; H01L21/52; (IPC1-7): C09J7/02; C09J7/02; C09J7/02; C09J7/02; C09J7/02; C09J7/02; H01L21/52; H01L21/301
Domestic Patent References:
| JP3037284A | ||||
| JP3109472A |
Attorney, Agent or Firm:
Shunichiro Suzuki
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