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Title:
TEMPERATURE INFORMATION OUTPUT DEVICE FOR SEMICONDUCTOR MEMORY ELEMENT, AND EXECUTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2007093607
Kind Code:
A
Abstract:

To provide a temperature information output device and method for semiconductor memory element, in which temperature correction process is performed in the inside of a semiconductor memory element chip.

This device comprises a temperature-sensing outputting a first voltage, while making the potential level thereof fluctuate, in response to changes in the temperature; a comparison part for increasing or decreasing, in response to a value of comparison of the first voltage with a potential level of a second voltage, a set digital code value and outputting the result as an adjustment code; and a potential level adjustment part determining, in response to a temperature control code and the adjustment code, a potential level where the second voltage can fluctuate to a maximum and a potential level where the second voltage can be fluctuated to a minimum, and adjusting and outputting the potential level of the second voltage corresponding to it.


Inventors:
TEI CHINSHAKU
Application Number:
JP2006269942A
Publication Date:
April 12, 2007
Filing Date:
September 29, 2006
Export Citation:
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Assignee:
HYNIX SEMICONDUCTOR INC
International Classes:
G01K7/01; G01K15/00; G11C11/406; H01L21/8242; H01L27/108
Domestic Patent References:
JP2004079158A2004-03-11
JPH03293530A1991-12-25
JP2002516986A2002-06-11
JP2004273103A2004-09-30
JPS59171822A1984-09-28
JP2005031077A2005-02-03
JP2005106818A2005-04-21
JP2007327932A2007-12-20
Foreign References:
US6006169A1999-12-21
Attorney, Agent or Firm:
Ichiro Kudo